MEMS packaging on a budget (fiscal and thermal).

Michael B. Cohn Ryan Roehnelt Ji-Hai Xu Alexander Shteinberg Steven Cheung

Published in: ICECS (2002)

Keyphrases

high speed
infrared
high density
design process
power plant
visible spectrum
neural network
injection lasers
air temperature
computer vision
probabilistic model
limited memory
heat transfer
multiscale
room temperature
electrical properties
thermal conductivity
real time
solder ball connect