Finite element analysis on stress/strain in CBGA solder joint with different substrates under thermal cycle.
Yang PingCaijun ShenPublished in: Int. J. Manuf. Technol. Manag. (2009)
Keyphrases
- finite element analysis
- stress distribution
- finite element
- finite element model
- computer aided design
- mechanical properties
- material properties
- using artificial neural networks
- temperature field
- high temperature
- high density
- friction coefficient
- optimization algorithm
- image sequences
- optimization problems
- room temperature
- pattern recognition