Numerical analysis of thermo-mechanical characteristics of solder joint depending on change in solder junction structure of MCP.
YongHyuk KwonHeeSeon BangSungmin JooHanSur BangPublished in: Microelectron. Reliab. (2015)
Keyphrases
- numerical analysis
- mechanical properties
- image enhancement
- data mining
- high temperature
- data structure
- failure rate
- information systems
- algebraic structure
- hierarchical structure
- ground motions
- semiconductor devices
- finite element model
- structural information
- database
- control system
- information retrieval
- neural network
- real time