Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemes.
Luke EnglandSiew Tze EngChris LiewHock Heng LimPublished in: Microelectron. Reliab. (2011)
Keyphrases
- bond pad
- parameter optimization
- wire bonding
- stress response
- mechanical properties
- finite element model
- genetic algorithm ga
- differential evolution
- genetic algorithm
- parameter estimation
- parameter settings
- finite element
- feature selection
- support vector machine
- experimental data
- boundary conditions
- integrated circuit
- pid controller
- neural network
- missing data
- optimization method
- hyperparameters
- simulated annealing
- markov random field
- artificial neural networks