Hock Heng Lim

Publication Activity (10 Years)

Years Active: 2011-2011
Publications (10 Years): 0

Publications

Luke England, Siew Tze Eng, Chris Liew, Hock Heng Lim
Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemes. Microelectron. Reliab. 51 (1) (2011)