An ultra low power 3D integrated intra-chip silicon electronic-photonic link.
Erman TimurdoganZhan SuKrishna T. SettaluriSen LinSajjad MoazeniChen SunGerald LeakeDouglas D. CoolbaughBenjamin R. MossMichele MorescoVladimir StojanovicMichael R. WattsPublished in: OFC (2015)