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V-Band End-Fire Radiating Planar Micromachined Helical Antenna Using Through-Glass Silicon Via (TGSV) Technology.
Aqeel Hussain Naqvi
Jeong-Heum Park
Chang-Wook Baek
Sungjoon Lim
Published in:
IEEE Access (2019)
Keyphrases
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patch antenna
microstrip
ground plane
waveguide
simulation software
multi band
dual band
frequency band
gallium arsenide
low cost
solar cell
transmission line
high speed
cmos technology
resonant frequency
high density
low pass filter
frequency response
case study
thin film
d objects