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Thermal aware cell-based full-chip electromigration reliability analysis.

Syed M. AlamDonald E. TroxelCarl V. Thompson
Published in: ACM Great Lakes Symposium on VLSI (2005)
Keyphrases
  • reliability analysis
  • power plant
  • high speed
  • low cost
  • infrared
  • single chip
  • high density
  • fault tree
  • real world
  • machine learning
  • case study
  • data analysis
  • soft computing
  • optimization model