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Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability.

Mukta G. FarooqG. La RosaFen ChenPrakash PeriasamyTroy L. Graves-abeChandrasekharan KothandaramanC. CollinsW. LandersJ. OakleyJ. LiuJohn SafranS. GhoshS. MittlD. IoannouCarole GraasDaniel BergerSubramanian S. Iyer
Published in: IRPS (2015)
Keyphrases
  • thin film
  • real time
  • data sets
  • data integration
  • reliability analysis
  • high impact
  • database
  • databases
  • information retrieval
  • clustering algorithm
  • factors that influence