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Design, Fabrication and Testing of Assembly Features for Enabling Sub-micron Accurate Passive Alignment of Photonic Chips on a Silicon Optical Bench.
J. F. C. van Gurp
Marcel Tichem
Urs Staufer
Published in:
IPAS (2012)
Keyphrases
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high density
high speed
electron beam
integrated circuit
feature set
design process
feature space
co occurrence
printed circuit boards
feature vectors
high accuracy
design methodology
product design
cmos technology
semiconductor devices