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Smart Vision Chip Fabricated Using Three Dimensional Integration Technology.
Hiroyuki Kurino
Masaki Nakagawa
Kang Wook Lee
Tomonori Nakamura
Yuusuke Yamada
Ki Tae Park
Mitsumasa Koyanagi
Published in:
NIPS (2000)
Keyphrases
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three dimensional
high speed
cmos technology
silicon on insulator
cmos image sensor
computer vision
low cost
data processing
real time
range images
low power
rapid development
vision system
smart spaces
enabling technologies
cost effective
single chip
d objects
information technology