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On Tolerating Faults of TSV/Microbumps for Power Delivery Networks in 3D IC.
Sheng-Hsin Fang
Chang-Tzu Lin
Wei-Hsun Liao
Chien-Chia Huang
Li-Chin Chen
Hung-Ming Chen
I-Hsuan Lee
Ding-Ming Kwai
Yung-Fa Chou
Published in:
ISVLSI (2017)
Keyphrases
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fault detection
packet switched
social networks
fault diagnosis
power consumption
network structure
data sets
network analysis
computer networks
network design
integrated circuit
response time
network model
e government
learning algorithm
network size
network parameters
high bandwidth
neural network