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Copper-filled anodized aluminum oxide a potential material for chip to chip bonding.
Kosuke Yamashita
Shunji Kurooka
Koji Shirakawa
Yoshinori Hotta
Hirofumi Abe
Published in:
3DIC (2015)
Keyphrases
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high speed
low cost
high density
thin film
single chip
vlsi implementation
printed circuit boards
physical design
programmable logic
analog vlsi
chip design
evolvable hardware
modular design
host computer