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Koji Shirakawa
Publication Activity (10 Years)
Years Active: 2015-2015
Publications (10 Years): 0
Top Topics
High Density
Programmable Logic
Modular Design
Top Venues
3DIC
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Publications
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Kosuke Yamashita
,
Shunji Kurooka
,
Koji Shirakawa
,
Yoshinori Hotta
,
Hirofumi Abe
Copper-filled anodized aluminum oxide a potential material for chip to chip bonding.
3DIC
(2015)