Login / Signup
Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations.
Emeka H. Amalu
Ndy N. Ekere
Published in:
Microelectron. Reliab. (2012)
Keyphrases
</>
high temperature
printed circuit boards
high density
prediction accuracy
prediction model
low cost
high speed
diesel engine
vlsi implementation
database systems
daily life
prediction error
prediction algorithm