Login / Signup

A Holistic Analysis of Circuit Performance Variations in 3-D ICs With Thermal and TSV-Induced Stress Considerations.

Sravan K. MarellaSachin S. Sapatnekar
Published in: IEEE Trans. Very Large Scale Integr. Syst. (2015)
Keyphrases
  • machine learning
  • statistical analysis
  • database
  • data sets
  • genetic algorithm
  • low cost
  • high speed
  • infrared
  • digital circuits