A Reconfigurable Power System-in-Package Module using GaN HEMTs and IC Bare Dies on LTCC Substrate: Design - Implementation - Experiment and Future Directions.
Van Ha NguyenNueraimaiti AimaierGabriel NobertTan PhamNicolas G. ConstantinYves BlaquièreGlenn E. R. CowanPublished in: NEWCAS (2022)
Keyphrases
- future directions
- power system
- current status
- lessons learned
- reduced order model
- design process
- current challenges
- current trends
- transmission line
- hardware implementation
- case study
- electrical power
- optimal power flow
- real world
- power grid
- adult literacy
- neural network
- machine learning
- artificial intelligence
- computational intelligence
- power quality
- active power