Login / Signup
Wafer level packaging having bump-on-polymer structure.
John J. H. Reche
Deok-Hoon Kim
Published in:
Microelectron. Reliab. (2003)
Keyphrases
</>
structural information
hierarchical structure
lower level
high density
database
neural network
data mining
feature selection
bayesian networks
low level
higher level
fine grained
geometric structure
massively parallel