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Deok-Hoon Kim
Publication Activity (10 Years)
Years Active: 2002-2003
Publications (10 Years): 0
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Publications
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John J. H. Reche
,
Deok-Hoon Kim
Wafer level packaging having bump-on-polymer structure.
Microelectron. Reliab.
43 (6) (2003)
Deok-Hoon Kim
,
Peter Elenius
,
Michael Johnson
,
Scott Barrett
Solder joint reliability of a polymer reinforced wafer level package.
Microelectron. Reliab.
42 (12) (2002)