Study of silicon core coaxial through silicon via for three dimensional integration.

Libo Qian Xitao He Kefang Qian Yinshui Xia

Published in: ISCAS (2018)

Keyphrases

three dimensional
high speed
high density
neural network
machine learning
information retrieval
artificial intelligence
knowledge base
case study
data model
empirical studies
statistical analysis
data integration
experimental study
range images
simulation study