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Yield and timing constrained spare TSV assignment for three-dimensional integrated circuits.

Yu-Guang ChenKuan-Yu LaiMing-Chao LeeYiyu ShiWing-Kai HonShih-Chieh Chang
Published in: DATE (2014)
Keyphrases
  • integrated circuit
  • three dimensional
  • real time
  • image sequences
  • multi view
  • virtual reality
  • neural network
  • range images