Login / Signup
reinforcement on the microstructure and reliability of Sn-3.0Ag-0.5Cu solder joints.
Zhenyu Zhao
Lei Liu
Hyun Seok Choi
Jian Cai
Qian Wang
Yuming Wang
Guisheng Zou
Published in:
Microelectron. Reliab. (2016)
Keyphrases
</>
electron microscopy
mechanical properties
x ray
reinforcement learning
highly reliable
neural network
social networks
computer vision
decision making
image processing
reliability analysis
case study
high level
objective function