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Simulation of Copper Thin Film Thickness Optimization for Surface Plasmon using the Finite Element Method.
Tanaporn Leelawattananon
Kritsakorn Lorchalearnrat
Suphamit Chittayasothorn
Published in:
SIMULTECH (2017)
Keyphrases
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film thickness
thin film
white light interferometry
three dimensional
high density
finite element method
electrical properties
refractive index
numerical simulations
finite element
room temperature
neural network
object recognition
pairwise
d objects