Vertical pitch limitations on performance enhancement in bonded three-dimensional interconnect architectures.
James W. JoynerPayman Zarkesh-HaJeffrey A. DavisJames D. MeindlPublished in: SLIP (2000)
Keyphrases
- three dimensional
- high speed
- image enhancement
- image processing
- interconnection networks
- x ray
- multi view
- range images
- low cost
- image sequences
- virtual reality
- data mining
- surface reconstruction
- d objects
- data structure
- database
- artificial intelligence
- multistage
- fault tolerant
- computed tomography
- object modeling
- neural network