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Voltage Surges by Backside ESD Impacts on IC Chip in Flip Chip Packaging.

Takuya WadatsumiKohei KawaiRikuu HasegawaTakuji MikiMakoto NagataKikuo MuramatsuHiromu HasegawaTakuya SawadaTakahito FukushimaHisashi Kondo
Published in: IRPS (2022)
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