4-Layer Wafer on Wafer Stacking Demonstration with Face to Face/Face to Back Stacked Flexibility Using Hybrid Bond/TSV-Middle for Various 3D Integration.
C.-L. LuC.-H. ChuangC.-H. HuangS.-C. LinY.-H. ChangW.-Y. LaiM.-H. ChiuM.-H. LiaoS.-Z. ChangPublished in: VLSI Technology and Circuits (2023)