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Three-Dimensional Dynamic Random Access Memories Using Through-Silicon-Vias.

Toshiaki KirihataJohn GolzMatthew R. WordemanPooja BatraGary W. MaierNorman RobsonTroy L. Graves-abeDaniel BergerSubramanian S. Iyer
Published in: IEEE J. Emerg. Sel. Topics Circuits Syst. (2016)
Keyphrases
  • random access
  • three dimensional
  • high density
  • solid state
  • disk storage
  • image sequences
  • multi view
  • database
  • data structure
  • management system
  • multi dimensional
  • associative memory
  • integrated circuit