Fabrication and Characterization of a Multichannel 3D Thermopile for Chip Calorimeter Applications.

Tho Phuoc Huynh Yilei Zhang Cohen Yehuda

Published in: Sensors (2015)

Keyphrases

high density
high speed
low cost
integrated circuit
multi channel
analog vlsi
multiresolution
data center
magnetic recording
electron beam
vlsi implementation
semiconductor devices
data sets
cross channel
signal reconstruction
physical design
single chip
power consumption
evolutionary algorithm