Login / Signup
Fabrication and Feasibility of Through Silicon Via for 3D MEMS Resonator Integration.
Alper Kaan Soydan
Muhammed Berat Yuksel
Dilek Isik Akcakaya
Haluk Külah
Published in:
IEEE SENSORS (2019)
Keyphrases
</>
high density
high speed
semiconductor devices
plasma etching
low cost
data integration
data fusion
low density
real world
artificial intelligence
case study
information integration
silicon on insulator