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Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces.
H. W. Tseng
C. T. Lu
Y. H. Hsiao
P. L. Liao
Y. C. Chuang
T. Y. Chung
C. Y. Liu
Published in:
Microelectron. Reliab. (2010)
Keyphrases
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mechanical properties
electron microscopy
high speed
low cost
x ray
real time
databases
neural network
information systems
data structure
user interface
vlsi implementation
failure detection