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Electrodeposition of platinum-iridium alloy nanowires for hermetic packaging of microelectronics.
Artin Petrossians
John J. Whalen
James D. Weiland
Florian Mansfeld
Published in:
EMBC (2012)
Keyphrases
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high density
high power
high speed
mechanical properties
design process
multiresolution
computer vision
knowledge base
computational complexity
thin film
room temperature
wire bonding