Reliability investigation of the copper-zinc system for solid diffusion bonding in power modules.
Franc DugalMauro CiappaPublished in: Microelectron. Reliab. (2017)
Keyphrases
- power consumption
- anisotropic diffusion
- thin film
- case study
- three dimensional
- diffusion process
- power distribution systems
- reliability analysis
- diffusion model
- information technology
- genetic algorithm
- building blocks
- printed circuit boards
- power distribution
- software modules
- modular architecture
- diffusion models
- magnetic recording
- information systems