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Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process.
Meiying Su
Liqiang Cao
Tingyu Lin
Feng Chen
Jun Li
Cheng Chen
Gengxin Tian
Published in:
Microelectron. Reliab. (2018)
Keyphrases
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experimental verification
mathematical model
rms error
evolutionary algorithm
higher level
data mining
real time
machine learning
genetic algorithm
search engine
social networks
knowledge base
design process
development process