A low-overhead fault tolerance scheme for TSV-based 3D network on chip links.
Igor LoiSubhasish MitraThomas H. LeeShinobu FujitaLuca BeniniPublished in: ICCAD (2008)
Keyphrases
- fault tolerance
- low overhead
- load balancing
- fault tolerant
- distributed systems
- network on chip
- peer to peer
- high reliability
- mobile agents
- response time
- interconnection networks
- routing algorithm
- energy efficient
- grid computing
- network simulator
- high precision
- parallel algorithm
- low cost
- shared memory
- wireless sensor networks
- data sets