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Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages.
Li Zhang
Vivek Arora
Luu Nguyen
Nikhil Kelkar
Published in:
Microelectron. Reliab. (2004)
Keyphrases
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failure rate
artificial intelligence
significant improvement
information retrieval
three dimensional
mechanical properties
numerical data
finite difference
reliability analysis