First Demonstration of a Design Methodology for Highly Reliable Operation at High Temperature on 128kb 1T1C FeRAM Chip.
Tiancheng GongLihua XuWei WeiPengfei JiangPeng YuanBowen NieYuanquan HuangYuan WangYang YangJianfeng GaoJunfeng LiJun LuoLingfei WangJianguo YangQing LuoLing LiSteve S. ChungMing LiuPublished in: VLSI Technology and Circuits (2023)
Keyphrases
- design methodology
- highly reliable
- high temperature
- physical design
- vlsi design
- chip design
- design criteria
- knowledge base
- fuzzy neural network
- design methodologies
- object oriented
- design procedure
- formal specification
- design process
- power dissipation
- database
- hw sw
- input output
- query optimization
- pattern recognition
- decision making
- neural network
- real time