Login / Signup
Yield Enhancement by Bad-Die Recycling and Stacking With Though-Silicon Vias.
Yung-Fa Chou
Ding-Ming Kwai
Cheng-Wen Wu
Published in:
IEEE Trans. Very Large Scale Integr. Syst. (2011)
Keyphrases
</>
high density
image enhancement
integrated circuit
image processing
combining multiple
low cost
high speed
thin film
genetic algorithm
multiresolution
ensemble learning
plasma etching