Multimaterial and Multilayer Direct Digital Manufacturing of 3-D Structural Microwave Electronics.
Kenneth H. ChurchNathan B. CranePaul I. DeffenbaughThomas P. KetterlClayton G. NeffPatrick B. NesbittJustin T. NussbaumCasey PerkowskiHarvey TsangJuan CastroJing WangThomas M. WellerPublished in: Proc. IEEE (2017)