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Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints.

H. B. QinX. P. ZhangM. B. ZhouX. P. LiYiu-Wing Mai
Published in: Microelectron. Reliab. (2015)
Keyphrases
  • electron microscopy
  • mechanical properties
  • x ray
  • hierarchical structure
  • dynamic behavior
  • website
  • three dimensional
  • network structure
  • database
  • real time
  • scale space
  • graph structure
  • thin film