H. B. Qin

Publication Activity (10 Years)

Years Active: 2014-2015
Publications (10 Years): 1

Top Topics

Mechanical Properties

Dynamic Behavior

Top Venues

Microelectron. Reliab.

Publications

H. B. Qin, X. P. Zhang, M. B. Zhou, X. P. Li, Yiu-Wing Mai
Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints. Microelectron. Reliab. 55 (8) (2015)
H. B. Qin, W. Y. Li, M. B. Zhou, X. P. Zhang
Low cycle fatigue performance of ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints. Microelectron. Reliab. 54 (12) (2014)