8-Layer 3D Vertical Ru/AlOxNy/TiN RRAM with Mega-Ω Level LRS for Low Power and Ultrahigh-density Memory.
Shengjun QinMaryann C. TungEmma BelliveauShuhan LiuJimin KwonWei-Chen ChenZizhen JiangS. Simon WongH.-S. Philip WongPublished in: VLSI Technology and Circuits (2022)