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Thermal analysis of multi-layer functional 3D logic stacks.
Michael Scheuermann
Shurong Tian
Raphael Robertazzi
Matthew R. Wordeman
C. Bergeron
H. Jacobson
Phillip J. Restle
Joel Silberman
Christy Tyberg
Published in:
3DIC (2016)
Keyphrases
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multi layer
higher order
infrared
decision making