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Guest Editorial for Special Issue on High-Performance Multichip Interconnections.
Vladimir Stojanovic
Chih-Kong Ken Yang
Ron Ho
Published in:
IEEE Trans. Circuits Syst. II Express Briefs (2010)
Keyphrases
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special issue
ai edam
ecml pkdd
international journal
high density
scientific computing
applied intelligence
cost effective
high efficiency
high reliability
machine learning
computational intelligence
future directions