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Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits.
Sten Vollebregt
Ryoichi Ishihara
Johan van der Cingel
Kees Beenakker
Published in:
3DIC (2011)
Keyphrases
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integrated circuit
input output
data fusion
lower cost
neural network
database systems
data driven
information integration
database
databases
search engine
relational databases
electron beam