Thermal placement for high-performance multichip modules.
Kai-Yuan ChaoD. F. WongPublished in: ICCD (1995)
Keyphrases
- infrared
- modular structure
- power plant
- multiscale
- building blocks
- solder ball connect
- cost effective
- modular architecture
- small sized
- modular robots
- bayesian networks
- information retrieval
- high reliability
- neural network
- genetic algorithm
- pc cluster
- learning algorithm
- website
- scientific computing
- finite element analysis
- low cost
- case study
- knowledge structures
- high efficiency
- power consumption
- database
- control system