Simultaneous wafer bonding type selection and layer assignment for TSV count minimization.

Chun-Hua Cheng Wei-Shuo Tzeng Shih-Hsu Huang

Published in: APCCAS (2012)

Keyphrases

objective function
selection strategy
information systems
three dimensional
selection algorithm
image segmentation
multiscale
multi layer
integrated circuit
selection criteria
application layer