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The stress analysis and parametric studies for the low-k layers of a chip in the flip-chip process.
Lin Lin
Jun Wang
Lei Wang
Wenqi Zhang
Published in:
Microelectron. Reliab. (2016)
Keyphrases
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single chip
low cost
quantitative analysis
data analysis
high density
literature review
comprehensive analysis
analog vlsi
real time
data sets
information systems
image analysis
wireless sensor networks
low power consumption
functional verification