A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration.
Weng Hong TehRaymond CaramtoJamal QureshiSitaram ArkalgudM. O'BrienT. GildayKou MaekawaT. SaitoKouichi MaruyamaThenappan ChidambaramWei WangDavid MarxDavid GrantRuss DudleyPublished in: 3DIC (2009)