Login / Signup
Weng Hong Teh
Publication Activity (10 Years)
Years Active: 2009-2010
Publications (10 Years): 0
</>
Publications
</>
Weng Hong Teh
,
C. Deeb
,
J. Burggraf
,
D. Arazi
,
R. Young
,
C. Senowitz
,
A. Buxbaum
Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding.
3DIC
(2010)
Weng Hong Teh
,
Raymond Caramto
,
Jamal Qureshi
,
Sitaram Arkalgud
,
M. O'Brien
,
T. Gilday
,
Kou Maekawa
,
T. Saito
,
Kouichi Maruyama
,
Thenappan Chidambaram
,
Wei Wang
,
David Marx
,
David Grant
,
Russ Dudley
A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration.
3DIC
(2009)