A. Buxbaum

Publication Activity (10 Years)

Years Active: 2010-2010
Publications (10 Years): 0

Publications

Weng Hong Teh, C. Deeb, J. Burggraf, D. Arazi, R. Young, C. Senowitz, A. Buxbaum
Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding. 3DIC (2010)